The Impact of ALD Precursor Choice on Nucleation and Growth of Dielectrics on 2D Materials

Abstract

Recently, atomically thin two-dimensional (2D) transition metal dichalcogenides (TMDs) have received significant attention due to their unique optical and electrical properties, lending themselves to exciting applications such as microelectronics, sensing, catalysis, photonics, and more. The properties of TMDs can be acutely impacted by their environment due to their atomic thinness. For instance, in a TMD-based transistor with a high-k dielectric surrounding the TMD semiconductor, the dielectric could dope the channel via charge transfer; it can improve charge carrier mobility by screening the impact of charged impurities on scattering; or it can worsen charge carrier mobility by introducing defect states or interfacial roughness. As such, the quality and nature of the dielectric is critical, and ultimately those properties are determined by the means of dielectric deposition. Atomic layer deposition (ALD) is a common thin film deposition technique used for depositing high-k dielectrics for transistor devices. ALD relies on sequential self-limiting reactions between a precursor or co-reactant and a surface in order to deposit a material in a layer-by-layer manner with a high degree of control over thickness, composition, and uniformity. However, the ideal basal planes of 2D materials possess no dangling bonds or reactive functional groups, making their surfaces largely inert to ALD chemistry. Hence, when conventional ALD is performed on TMDs, nucleation and growth proceeds only at defect sites, grain boundaries, and the more reactive edge sites. This sparse nucleation leads to poor quality films of low density, high surface roughness, and pinholes.In this work, we employ physisorption-assisted ALD processes and study the nucleation and quality of the deposited dielectrics. We deposit AlOx on atomically thin monolayer MoS2 (itself on SiO2/Si) using a series of ALD precursors in order to investigate the impact of the ALD precursor on nucleation. Using scanning electron microscopy (SEM), we study film nucleation and continuity as a function of ALD precursor, cycle number, and temperature. After optimizing each process for each precursor in terms of temperature and purge time for maximized nucleation, we fabricate transistor devices in which the deposited AlOx serves as a seed layer for high-k HfO2 deposition to create the gate stack. Au contacts and a Pd top gate were used to complete the devices. Using x-ray photoelectron spectroscopy (XPS) and electrical testing, we investigate the character of the dielectric/MoS2 interface. We observe that the precursor used in the ALD process can lead to a wide range of coverages, with more conventional precursors resulting in sparse coverage, and novel precursors introduced in this study leading to nearly full coverage after just 3 nm of AlOx is deposited. We hypothesize that the improved coverage for the novel precursor is the result of enhanced interactions between the precursor and the 2D material due to its particular chemical structure. The reduced nucleation delay leads to a denser, smoother film with fewer defects at the 2D/3D material interface. The devices fabricated using the novel precursor and improved dielectric show excellent performance such as good on/off ratios (106), small device-to-device variation (ΔV T < 1 V), and low effective oxide thickness (~1 nm). This work provides useful insights into how ALD precursors could be designed to improve the quality of dielectrics on 2D materials, potentially improving the viability of 2D materials for wide ranging applications.