The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors.

Seung-Ho Ok,Byungin Moon,Sung Lim,Yong-Hwan Lee,Jae Shim

doi:10.3390/s17020426

Abstract

Recently, stereo matching processors have been adopted in real-time embedded systems such as intelligent robots and autonomous vehicles, which require minimal hardware resources and low power consumption. Meanwhile, thanks to the through-silicon via (TSV), three-dimensional (3D) stacking technology has emerged as a practical solution to achieving the desired requirements of a high-performance circuit. In this paper, we present the benefits of 3D stacking and process technology scaling on stereo matching processors. We implemented 2-tier 3D-stacked stereo matching processors with GlobalFoundries 130-nm and Nangate 45-nm process design kits and compare them with their two-dimensional (2D) counterparts to identify comprehensive design benefits. In addition, we examine the findings from various analyses to identify the power benefits of 3D-stacked integrated circuit (IC) and device technology advancements. From experiments, we observe that the proposed 3D-stacked ICs, compared to their 2D IC counterparts, obtain 43% area, 13% power, and 14% wire length reductions. In addition, we present a logic partitioning method suitable for a pipeline-based hardware architecture that minimizes the use of TSVs.

Highlights

Various types of sensors that provide three-dimensional (3D) depth information include stereo cameras, radar, and time-of-flight cameras [1,2]
We summarize our contributions as follows: (1) We show the impact of 3D stacking on power consumption based on a practical implementation of 3D integrated circuit (IC); (2) to show the impact of partitioning on 3D ICs, we present two types of partitioning methods: the proposed pipeline-level partitioning and conventional macro-level partitioning; (3) we provide design considerations for low-power 3D IC design from a comprehensive analysis and implementation results; and (4) we study the impact of both device and through-silicon via (TSV) scaling on the power and area benefits of 3D ICs
We described the benefits of TSV-based 3D stacking and the impact of device technology scaling on the performance of the stereo matching processor

Summary

Introduction

Various types of sensors that provide three-dimensional (3D) depth information include stereo cameras, radar, and time-of-flight cameras [1,2]. To obtain a dense depth map from a pair of stereo images, stereo matching processors have been adopted in real-time embedded systems such as intelligent robots and autonomous vehicles [3,4,5]. Important requirements for stereo matching processors are a high frame rate with minimal hardware resources and low power consumption [6]. To achieve these requirements in the design of stereo matching processors, we adopt a TSV-based 3D stacking technology that has emerged as a practical solution for hardware miniaturization and low-power circuits. The stereo matching processor requires a wide bandwidth because of the memory-intensive nature of stereo image processing. Stereo matching processors are promising candidates for fully exploiting the benefits of 3D stacking technology

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Methods

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Conclusion