Abstract
On the benefit of the deeply development of MEMS and inertial instrument technology, the novel micro technology for positioning, navigation and timing (μΡΝΤ) becomes the substitution of GPS technology, and is the one of the most popular research area. The μ PNT unit volume can be pressed obviously by employing 3D stack technology after MEMS components are finished, and through silicon vias (TSV) technology connects the pins inside the stack with outside ones. 3D stack and TSV technology improves the reliability and high G-shock survival ability of μPNT unit. The silicon on glass (SOG) style is one of the most common structure for MEMS sensor, and the special TSV technology aimed at SOG is researched in this paper to support the SOG structure based μPNT unit.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
