Abstract
The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram Bar-Cohen during 2012–2015 to target an order of magnitude improvement in chip level and hot spot heat fluxes, compared to the then state-of-the-art (SOA). Evaporative cooling technologies to achieve potential targets of 1 kW/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> at the chip level and 5 kW/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> at the hot spot level were targeted. A key goal was to improve fundamental understanding of the evaporative cooling physics at the relevant scales, and a numerical modeling capability to enable the co-design of such solutions in emerging computing and communications systems. A summary of the five projects pursued under this effort is provided, including the key accomplishments and developed capabilities.
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