Abstract
Changes in resonator behavior in the presence of helium were observed at low temperature in sealed microstructures. The effects were seen with microelectromechanical systems (MEMS) resonators employing reflowed glass and/or direct silicon bonded sealing interfaces. Resonator Q, peak gain and frequency all indicate the degradation of vacuum quality due to low temperature ingress of helium into the sealed vacuum chamber. These effects were seen between 23 and 100 °C after and during helium exposure at relatively low pressures of 140 to 380 kPa. Similar effects were not observed for hydrogen, argon and air. The results may suggest diffusion of helium through silicon at low temperatures and have implications for hermeticity testing using MIL-STD 883E, applications for the exposure of a wide variety of MEMS devices to helium and possibly wafer processing using helium.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
