Abstract
We reported the reliability of Sn0.3Ag0.7Cu (SAC0307) solder joints under electrical and thermal coupling fields, where the c-axes of Sn grains were all nearly parallel to the direction of current and thermal flows. In these studies, individual electromigration (EM), individual thermomigration (TM), and thermoelectric coupling migration behaviors were investigated by applying a current density of 104 A/cm2, and a temperature gradient of 103°C/cm at Cu/SAC0307/Cu solder joints, respectively. The SEM and EBSD were utilized to characterize the morphologies and crystal orientations of each solder joint. The results indicated that the Cu atoms tended to migrate to the anode side under EM. The thickness of an interfacial intermetallic (IMC) layer at the anode increased 3.93 μm. In addition, the Cu atoms diffused toward the lower temperature side under TM, and the thickness of the IMC layer at cold side increased 1.72 μm. When the solder joints were experiencing the coupling fields with the same directions of current and thermal flows, the thickness of IMC layer at anode side (cold side) could increase up to 7.67 μm. The results showed that the effect of thermal flow could assist to accumulate the IMC at the anode side, and accelerate the migration of Cu atoms. This research could help to further understand the reliability behaviors of SAC0307 solders under the service environment.
Published Version
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