Abstract
Direct current (DC) magnetron sputtering method was used to deposit vanadium oxide thin films on ordinary glass substrates from a vanadium metal target and a five factors four levels orthogonal experimental method was used to find the best combination of sputtering pressure, sputtering power, oxygen/argon flow ratio, substrate temperature and deposition time for fabricating high temperature coefficient of resistance (TCR) vanadium oxide film. The results indicate that a good combination of these parameters should be 1Pa, 160W, 1.5/25, 280°C and 60 minutes. And the film fabricated using this parameters combination is mainly composed of V2O5and has a resistance range of 80.3kΩ to 40kΩ while its temperature changed from 20°C to 80°C.
Published Version
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