Abstract
In this study, nano-Si3N4 was employed to enhance thermal performance of phase change materials (PCMs), and a new formula was proposed to explain the relationship between the thermal conductivity and the latent heat. Ultrasonically stirred, the composite PCMs were prepared at 80°C with different additional rate (1, 2, 3, 4, 5, 10wt%). The experimental results showed that the thermal conductivity of composite PCMs increased with the increasing Si3N4 loading contents, and the thermal conductivity increased by 35% while the thermal diffusivity increased by 47% at 10wt% Si3N4 additional fraction. Additionally, there was an interesting phenomenon. The latent heat of the composite PCMs at 1wt% addition rate was 3.4% higher than that of paraffin, that has been rarely reported in articles. An explanation was provided from crystallography and thermodynamic. A calculation method was also performed with relative errors in the range of 5.68%.
Published Version
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