Abstract
The Cu-Ce infiltration layer was formed on 304 Stainless Steel surface by double glow plasma surface metallurgy technology. The effects of source voltage and cathode voltage on surface alloying concentration, surface hardness and infiltration layer depth were analyzed by comparative test. The results showed: In the experimental range, the contents of Cu and Ce, surface hardness, deposition layer depth increase with the source voltage increasing, which is contrary to the cathode voltage; the diffusion layer depth increases with either voltage increasing in a certain range.
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