Abstract
Although the use of ultrasonic agitation on quartz crystal devices during PCB cleaning has long been suspected to be detrimental, little or no data exist to substantiate or quantify the resultant effects. This paper summarises the results of a limited study into these effects for a range of quartz crystal devices, using both CFC and aqueous solvents. The variations with exposure time, and the types and mechanisms of failure are discussed. The results are encouraging and suggest that, although these devices are more susceptible to damage than ICs, once manufacturing defects have been screened out they will withstand ultrasonic exposure without deleterious effects for periods several times longer than those used for cleaning PCBs.
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