Abstract
Anisotropic conductive adhesives (ACAs) are used in radio frequency identification tags (RFID tags) because of their advantages compared with conventional solders. However, some reliability problems may occur in the joints when the tags are exposed to high or fluctuating temperatures. Temperature cycling tests and constant temperature tests can be used to study the effects of temperature on reliability. With these tests, the failure modes and mechanisms can be found faster. Nevertheless, if an excessively rigorous test is chosen, the failure mechanisms and modes may not be the primary causes of failure in the operating environment of the tags. In this study, the reliability of a tag with ACA joints was studied with two different temperature cycling tests and two different constant temperature tests. Four different test series with varying bonding parameters were tested. The reliability of the tags was verified in each test by monitoring the daisy chain resistance of the ACA joints. The results from the test with the wider temperature range were achieved fastest. However, the behavior of the test series varied when compared with each other during different temperature cycling tests and differences in failure modes between the two temperature cycling tests were observed. Consequently, the test with the wider temperature range revealed failure mechanisms different from those seen during the less rigorous test. Due to this, the test with the wider temperature range may not have shown the primary failure modes and it is possible that these results do not correctly reflect the differences between the test series under use conditions.
Published Version
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