Abstract
The results of a series of experiments aimed at identifying optimal processing windows for a model epoxy-based encapsulant material used in integrated circuit packages are reported in this paper. Several key material characteristics were evaluated as a function of processing conditions, including glass transition temperature ( T g), coefficient of thermal expansion, flexural strength, flexural modulus, ultimate flexural strain, and package warpage. The processing variables evaluated included cure temperature, cure time, type of cure schedule (single step, two step, or discontinuous). These results confirm that alternative cure schedules to those reported on manufacturer's data sheets are often available that provide an acceptable balance of material properties for specific applications.
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