Abstract
Purpose – Anisotropic conductive film (ACF) offers miniaturization of package size, reduction in interconnection distance and high performance, cost‐competitive packaging and improved environmental impact. However, a major limitation for ACF is the instability caused by thermal warpage. The purpose of this paper is to study the effects of thermal warpage on contact resistance in real time i.e. make online measurements of contact resistance fluctuations while the assembly undergoes thermal shock.Design/methodology/approach – The ACF assemblies are subjected to thermal cycling with different temperature profiles that have peak temperatures either below or above the glass transition temperature (Tg) of the ACF. The flex substrate used was made of polyimide film, with Au/Ni/Cu electrodes and a daisy‐chained circuit matched to the die bump pattern. The ACF used was based on epoxy resin in which nickel and gold‐coated polymer particles are dispersed. A comparative study was carried out on the results obtained.F...
Published Version
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