Abstract
Low temperature oxidation of a Cu-base leadframe has been made to investigate the effect of Cu oxidation on the adhesion of Cu-base leadframe (Cu L/F) to epoxy molding compounds (EMC). In contrast to previous studies, the existence of small amount of cupric oxide (CuO) was observed next to the Cu/sub 2/O, confirming the oxide layer structure of Cu/Cu/sub 2/O/CuO/air. It was shown that the early stage of oxidation improved the adhesion strength between EMC and Cu leadframe. Furthermore the optimum copper oxide thickness required for the maximum pull strength ranged from 20 nm to 30 nm. The high pull strength was presumably due to the increase of surface wettability and mechanical interlocking effects resulting from oxidation. The Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) studies on the Cu L/F and EMC surface after pull test indicated that failure modes before the maximum adhesion were a mixture of the adhesive failure between Cu/sub 2/O and CuO interface plus the EMC cohesive failure. After the maximum adhesion, the failure modes changed to the adhesive failure of Cu/Cu/sub 2/O interface as the copper oxide thickness further increased.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
