The effect of substrate temperature on the critical velocity in microparticle impact bonding

Ievgeniia Chaban,Keith A. Nelson,Yuchen Sun,Christopher A. Schuh,David Veysset

doi:10.1063/5.0055274

Abstract

A number of nascent coating and micromanufacturing processes involve particles sprayed at a high velocity, which impact a substrate, deform, and adhere. Successful bonding between the particles and the substrate requires impact velocities higher than the so-called critical adhesion velocity. This critical velocity is influenced by the temperature of the substrate, a variable that we isolate in this work by conducting single-particle impacts on a variable-temperature substrate for three systems (Al–Al, Sn–Sn, and Ti–Ti) with particles individually selected within a narrow size distribution. Our results quantitatively connect the increase in substrate temperature to a significant lowering of the critical velocity, which we attribute to the lower dynamic strength of the thermally softened substrate. The data are generally consistent with expectations for bonding being controlled by a hydrodynamic process of jetting upon impact.

Highlights

Among these parameters, the substrate temperature is important since substrate deformation and rupture of the oxide on the substrate through such deformation are critical to forming metallurgical bonds with the particle
Our results quantitatively connect the increase in substrate temperature to a significant lowering of the critical velocity, which we attribute to the lower dynamic strength of the thermally softened substrate
Based on the published literature, there are no experimental results on the critical velocity as a function of initial substrate temperature

Summary

Introduction

The substrate temperature is important since substrate deformation and rupture of the oxide on the substrate through such deformation are critical to forming metallurgical bonds with the particle.

Results

Conclusion