Abstract
SummaryRecent advances in the classic magnetron sputter cathode design have enabled higher quality thin films and improved deposition rates. New designs that have eliminated traditional sputter target hold down fixtures and the retraction of the dark space shield have greatly increased the available sputter target surface area while reducing the probability of re‐deposition of target material on cathode components that could lead to shorting and contamination. Hermetic sealing strategies have mitigated gas permeation through the sputter cathode and enabled lower operating pressures which substantially reduces process gas inclusions in sputtered films.
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