Abstract
PurposeTo study the behaviour of voids in PBGA solder joints and their influence on the lifetime of lead‐free solder joints.Design/methodology/approachThe behaviour of voids was studied using micro via and land pad PWBs, PBGA components, and by measuring voids in the solder joints. The lifetimes of solder joints were tested using accelerated temperature tests.FindingsNumber of factors affecting the solder joint lifetimes were found. The voids were discovered to have a significantly large influence on the solder joints.Practical implicationsThe findings can be used to achieve better soldering results, methods, and designs.Originality/valueIn this paper, the effect and the behaviour of voids were studied profoundly. The findings can be valuable to researchers and process personnel.
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