Abstract
The effect of addition of copper nanoparticles to a urea-formaldehyde (UF) adhesive on the physical and mechanical properties of particleboards manufactured from date palm waste (DPW) was investigated. The variable factors in the study included copper nanoparticles in amounts of 6 and 8 wt.% of the dry mass of wood, pressing durations of 5 and 6 min, and pressing temperatures of 150 and 160°C. The physical and mechanical properties of manufactured boards were measured according to EN standards. The results showed that the addition of copper nanoparticles to the UF adhesive considerably improved the physical and mechanical properties of the boards and shortened the pressing duration. The boards manufactured with 6 wt.% copper nanoparticles in a dry mass of wood mixed with the adhesive and pressed at a temperature of 160°C for 5 min had mechanical properties exceeding the EN312-2 standard levels.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
