Identifying best parameters of particleboard bonded with dextrin-based adhesives

Ragil Widyorini,Eka Mulya Alamsyah,Arif Nuryawan,Sutrisno Sutrisno

doi:10.1515/opag-2020-0037

Ragil Widyorini, Eka Mulya Alamsyah + Show 2 more

Open Access

https://doi.org/10.1515/opag-2020-0037

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Abstract

Abstract The objective of this study was to evaluate the best parameters of particleboard manufacturing throughout the physical and mechanical properties’ test under Japanese Industrial Standard. Particleboard panels were manufactured from veneer waste of sengon wood (Paraserianthes moluccana) bonded with dextrin-based adhesives (DAs) and urea formaldehyde (UF) adhesives at the density target of 0.70 g/cm2 under various manufacturing parameters of adhesives composition, load pressure and pressure temperatures. The results showed that an increase in the value of physical and mechanical properties occurred on particleboards which were glued with DAs added with UF. As the addition of UF adhesive increases, the physical and mechanical properties of the particleboard also gradually increase. This confirms that a good bonding occurs when adding UF adhesives compared to using only dextrin. The particleboard manufacturing parameters demonstrated the best properties when 40% DA was mixed with 60% UF adhesives (DA–UF = 40:60 pbw; P12) for the physical test and 20% DA mixed with 80% UF (DA–UF = 20:80; P13) for the mechanical test for both particleboards under the load pressurized at 40 kgf/cm2 for 30 min at a temperature of 105°C.

Highlights

The objective of this study was to evaluate the best parameters of particleboard manufacturing throughout the physical and mechanical properties’ test under Japanese Industrial Standard
The objective of this study was to evaluate the best parameters for manufacturing particleboard of sengon wood (Paraserianthes moluccana) veneer waste bonded with dextrin-based adhesives (DAs) throughout its physical and mechanical properties’ test under Japanese Industrial Standard (JIS 2003)
That can be bonded using a mixture of 40% DA and 60% urea formaldehyde (UF) adhesives (DA–UF = 40:60) (P12) and pressurized at 40 kgf/cm[2] for 30 min at 105°C

Summary

Introduction

Abstract: The objective of this study was to evaluate the best parameters of particleboard manufacturing throughout the physical and mechanical properties’ test under Japanese Industrial Standard. The results showed that an increase in the value of physical and mechanical properties occurred on particleboards which were glued with DAs added with UF. As the addition of UF adhesive increases, the physical and mechanical properties of the particleboard gradually increase. This confirms that a good bonding occurs when adding UF adhesives compared to using only dextrin. The particleboard manufacturing parameters demonstrated the best properties when 40% DA was mixed with 60% UF adhesives (DA–UF = 40:60 pbw; P12) for the physical test and 20% DA mixed with 80% UF (DA–UF = 20:80; P13) for the mechanical test for both particleboards under the load pressurized at 40 kgf/cm[2] for 30 min at a temperature of 105°C

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Conclusion