Abstract
In this work we analyze the influence of the statistical distribution of copper grain sizes on the electromigration time to failure distribution based on numerical simulations. We have applied a continuum multi-physics electromigration model which incorporates the effects of grain boundaries for stress build-up. It is shown that the lognormal distribution of grain sizes causes a lognormal distribution for the times to failure. Moreover, the increase of the standard deviation of the grain size distribution results in an increase of the electromigration lifetimes standard deviation.
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