Abstract
SiC devices such as MOSFETs and SBDs reduce power loss in fast-switching condition as compared to Si devices. However, shallow and deep levels in SiC significantly affect dynamic characteristics of SiC devices. We already reported that high densities of deep levels were discovered in Al+-implanted samples other than the shallow Al acceptor level. In this work, we applied the deep level to the TCAD simulation, and examined the behavior of the carriers at high dV/dt conditions.
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