Abstract

Electron transmittance and tunneling current through high‐k dielectric gate stacks of metal‐oxide‐semiconductor (MOS) capacitors have been calculated by including an anisotropic mass and a transverse‐longitudinal kinetic energy coupling which is represented by a gate electron phase velocity. TiN/HfSiOxN/SiO2/p‐Si(100) structures with applying a negative bias voltage to the TiN metal gate is used to discuss the transmittance and tunneling current. In this work, the effects of the incident angle of electron and the valley in the anisotropic Si(100) to the transmittance and tunneling current are considered. It is found that the transmittance decreases as the electron gate phase velocity increases. It is also found that the transmittance and tunneling current get the highest at the incident angle of 0°. In addition, the transmittance is insignificantly affected by the valleys in the anisotropic Si(100) substrate.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.