Abstract
This research attempts to optimize the parameters for DC plating of silver on silver alloy of two differentcompositions namely 50% and 75% silver alloy. In the Silver –copper alloy, the surface morphology and compositionof the electro deposit are influenced by current density, silver concentration in the bath, applied current type andaddition of additive. It has been found that concentration of silver in silver alloy has an effect in weight electrodeposited over cathode in DC plating. The surface morphology is studied by taking SEM micrograph for thetwo different compositions of silver alloy and grain size is measured using XRD analysis. Higher the purity of silver,finer is the grain size. It has been observed that with the increase of silver in the sample, the amount of silverdeposited, hence the thickness of the deposit varies for the same current and voltage settings.
Highlights
Electroplated silver was developed primarily for use on hollowware, flatware and tableware
Numerous silver copper alloys in the range 99.8 percent silver down to 50 percent have been used for electric contacts, brazing and silver jewellery industry (McDonald, 1982).This research attempts to optimize the parameters for DC plating of silver over silver alloy for two different compositions namely 75% silver, 25%copper and 50%silver and 50%copper
In the Silver –copper alloy, the surface morphology and composition of the electro deposit are influenced by current density, silver concentration in the bath, applied current type and addition of additive ( Mohan, et al.,2005).The increase of current density has increased the amount of weight electrodeposited and the thickness of the silver deposit
Summary
Electroplated silver was developed primarily for use on hollowware, flatware and tableware. It is possible to produce fully bright deposits that require no further buffing or polishing This is achieved by including a brightening agent in the solution formula (Sarkar, 1971).Silver holds a distinguished position among the metals as it was the first metal covered by a patent for electroplating (Orr, 1982). The main purpose is to alter the characteristics of a surface so as to provide improved appearance, ability to withstand corrosive agents, resistance to abrasion or other desired properties or a combination of them (Nasser Kanani, 2004).But with the advent of pulse plating, which is defined as metal deposition by pulsed electrolysis (interrupted direct current to electroplate parts) the above said properties are improved (Knodler, A., 1986).Pulse plating leads to smoother and fine grained deposits (Shanthi, et al.,2008) and almost completely free of pinholes. Our present investigation is to optimize the parameters for DC plating of silver on silver alloy of two different compositions namely 50% and 75% silver alloy
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