Abstract
This research attempt is made to study the effect of base metal composition in pulse plating of silver over silver alloy.The effect of pulse parameters due to the electro deposition of silver over 50% silver alloy is studied and the results arecompared with the results obtained from the study of the effect of pulse parameters because of the electro deposition of75% silver alloy. The surfaces are characterized by scanning electron microscopy and X-ray techniques. Higher thepurity of silver, finer is the grain size. It is also evident that 75% silver alloy has more corrosion resistant than 50%silver alloy. It is suggested that the properties are improved in pulse plating if the concentration of silver in silver copperalloy is more.
Highlights
Pulse plating is becoming popular in the recent times because of its advantages in overcoming the problems of DC plating (Nasser Kanani, 2004)
It is evident that 75% silver alloy has more corrosion resistant than 50% silver alloy
It is suggested that the properties are improved in pulse plating if the concentration of silver in silver copper alloy is more
Summary
Pulse plating is becoming popular in the recent times because of its advantages in overcoming the problems of DC plating (Nasser Kanani, 2004). Pulse plating is evolving as an advantageous process over many nano processing technique because of the potentially very large number of pure metals, alloys and composite materials (Low, et al, 2004) that can be electrodeposited with grain sizes less than 100nm (Kim, et al, 2004). As the number of variables combination is large in pulse plating, possible improvements in properties can be achieved by research work for specific application. It is true for alloy plating as one more variable that is the concentration of the alloy metal, is involved. In the present study the base metal composition has been varied to 50% silver with 50% copper and the effects are studied by comparing the results obtained in 75% silver alloy to know the alloying behavior of the base metal
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