Abstract
The effect of crystal orientation on the behavior of a tungsten surface under a 30keV focused Ga+ ion beam with different bombardment angles has been investigated by in situ scanning electron microscopy and electron backscatter diffraction. Results indicate that the grains of tungsten with various orientations behave quite differently. Grains with a (001) direction parallel to the ion beam always maintain a much smoother surface morphology with less mass removal after ion bombardment, indicating a lower sputtering yield. The orientation dependence of surface sputtering of tungsten can be used to guide the fabrication of tungsten-based first wall component in a nuclear fusion reactor.
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