Abstract
AbstractA very simplified model of atomic‐scale etch pitting during sputtering erosion for composition depth profiling is used to modify the Benninghoven–Hofmann approach to layer‐by‐layer sputtering. It is shown that analytically tractable defining equations result, with solutions that indicate that etch pitting slightly worsens depth resolution as the probability of producing deep etch pits increases.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
