Abstract
The destructive bond pull test is the most common methodology for quality control of the wire bond process optimization on assembly manufacturing. It was introduced in the 1960's and it is described in U.S military specifications. Today, some of the hottest wire bonding processes is System-In-Package (SIP), Package-On-Package (PoP) and 3D package. These processes require lower loop height on thinner die thicknesses. Ultra Low Loop (ULL, <75 mm height) on thinner die (<100mm) utilizes this process. But, the bond pull test specifications for wire pull hook position and minimum wire breaking force are not sufficient to apply for the ULL and thinner die applications necessary to meet today's criteria. This paper is presented in order to give a universal test method of the wire pull test specification and methodology for the ULL on thinner die application and optimization. It will extend the reliability and quality control of advanced packaging.
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