The debonding failure mechanism analysis and performance experiments of 3D printed wiring boards

Abstract

Printed wiring boards (PWB) are widely regarded as supporting carriers for electronic circuit products. Compared with traditional manufacturing processes, 3D printing technology is more suitable for manufacturing circuit boards of various complex shapes. At present, 3D PWB products and experimental prototypes have been successfully developed by companies and scientific research institutions. However, there is a lack of research on the failure mechanism and reliability of 3D PWB, which is an important core issue for 3D PWB engineering applications. This paper studies the debonding mechanism between the 3D PWB wire and the substrate interface, and the physical and chemical processes of debonding failure and its influencing factors are analyzed. In this paper, a 3D printer based on the principle of fused deposition modeling (FDM) printing is established. At different curing temperatures (including 100 °C, 150 °C, 200 °C, 250 °C, 300 °C), the conductive silver paste was printed on the FR-4 substrate. The mechanical properties of the printed wire such as the elastic modulus, adhesive strength in the peeling direction and shearing direction were tested. Using a scanning electron microscope (SME) to further analyze the cross-section, the results show that under different curing temperature conditions, the performance of the printed wire varies with the pore size between the silver microparticles. According to the experimental results, suggestions for improvement of process design and process control of 3D PWB are proposed. The above research can improve the performance and reliability of 3D PWB and promote the base of 3D PWB engineering application.