Abstract
As a task in IMS-EFSOT (Intelligent Manufacturing Systems - next generation Environment Friendly Soldering Technology) program, considerable items in PWB (Printed Wiring Board) design for Pb-free products is studied. The findings about the relationship between PWB layout and the peak temperatures of mounted parts in reflow soldering as deliverables from the study of 2001-2003 is summarized. In this paper, findings about the relationship between PWB design and the fatigue reliability of Pb-free soldered leadless packages is given. Several parameters on the PWB and found key factors for dominating the lifetime of solder joint reliability is varied
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