The Buffer Effect of Different Wood Species and the Influence of Oak on Panel Composites Binders.

Franco Policardi,Marion Thebault

doi:10.3390/polym12071540

Abstract

The buffer action of certain wood species can intensely affect the curing and hardening of some thermosetting wood adhesives. The present article presents a quantification of such buffering effects, determined under controlled conditions, in various wood species. The buffer capacity of oak has been found to be rather extreme and is likely to affect quite heavily the ability of urea-formaldehyde (UF) and melamine-urea-formaldehyde (MUF) wood panel adhesives in industrial operations. A variation of the buffer capacity of furnishes containing between 0% and 30% oak chips has been investigated. This was correlated with the internal bond (IB) strength of MUF bonded laboratory particleboards. The wood mixture buffering capacity increases with the oak content, while the panel IB strength decreases.

Highlights

Wood-based panels and composites are used as intermediates in a wide range of industrial applications, such as, for example, furniture, construction, packaging or do it yourself (DIY) products [1].Particleboard, medium density fiberboard (MDF), oriented strand board (OSB) and plywood are the most common products in the wood panel industry, and are produced by means of synthetic adhesives
30% oak chips has been investigated. This was correlated with the internal bond (IB) strength of MUF bonded laboratory particleboards
The wood mixture buffering capacity increases with the oak content, while the panel IB strength decreases

Summary

Introduction

Wood-based panels and composites are used as intermediates in a wide range of industrial applications, such as, for example, furniture, construction, packaging or do it yourself (DIY) products [1]. Particleboard, medium density fiberboard (MDF), oriented strand board (OSB) and plywood are the most common products in the wood panel industry, and are produced by means of synthetic adhesives (resins). Besides the physical and mechanical wood species properties, their chemical composition, e.g., wood extractives, can play a role in bonding wooden surfaces [3]. Some studies showed that interactions between the physico-chemical characteristics of resins and the properties of the wood substrate strongly affect bond quality [4,5]

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Conclusion