Using Single Image Multi-Processing Analysis Techniques to Estimate the Internal Bond Strength of Particleboard

Abstract

The internal bond (IB) strength is generally considered the most significant adhesive bond quality of particleboard. However, traditional ways to measure IB strength are time consuming. The objective of this study was to use single image multi-processing analysis (SIMPA) techniques as a nondestructive testing (NDT) method to quickly estimate IB strength of particleboard. In this method, photographs of the particleboard edge surface were obtained, followed by multiprocessing of each photograph to measure percent resin coverage (%). The IB strength was estimated or predicted from a strong correlationship between the percent resin coverage and destructively measured IB strength. Handfelt single-layer particleboards were manufactured with various resin contents, densities or particle sizes. A phenol-formaldehyde (PF) resin was mainly used in the study and a melamine-urea formaldehyde (MUF) resin was also used in part of the experiments. Results showed that correlation coefficients (r) between the percent resin coverage and IB strength were between 0.76 and 0.92. It is concluded that SIMPA can be used as a nondestructive method to quickly estimate the IB strength of particleboard.