Abstract
The ATLAS experiment at the Large Hadron Collider is currently preparing for a significant upgrade of the Inner Detector (ID) for the High-Luminosity LHC operation, scheduled to start in 2027. A planned integrated luminosity of 4000 fb−1 implies integrated hadron fluences over 2×1016 neq/cm2, requiring a complete replacement of the existing ID. An all-silicon Inner Tracker is under development with a pixel detector surrounded by a strip detector. The strip detector consists of four barrel layers in the centre, while the forward regions are made of six disks at each end, with silicon-strip modules as basic units. With the production of modules scheduled to begin in 2020, a thorough understanding of the current prototype modules is critical. Electrical characterization of the module aims to assess the front-end performance in terms of input noise and noise occupancy. Results of input noise from modules built with different front-end designs are presented. Tracking resolutions and detection efficiency are evaluated in beam tests. Several module prototypes have been built and tested in 2018 and 2019. In this report, the beam test results from different module types are presented. Included are results from the first double-sided end-cap prototype module. The results focus on hit detection efficiencies and spatial resolution of the modules.
Highlights
Local SupportTwo different support structures provide mechanical stability and services like cooling, power and data transmission
The results focus on hit detection efficiencies and spatial resolution of the modules
The results presented in this document correspond to four different modules: the first double-sided R0 end-cap module [15], a non-irradiated Long Strip (LS) module and two irradiated LS and R0 modules
Summary
Two different support structures provide mechanical stability and services like cooling, power and data transmission. The bus-tape provides the electrical transmission for power, trigger, timing and control (TTC), data and detector control signals. The interface from staves and petals to the off-detector electronics is carried out through the EoS card. Bias voltage and detector control signals are sent from the EoS to the AMACs in the modules. Modules are glued directly onto the bus-tape, and the electrical connections are made via wire-bonds. A summary of recent electrical and beam tests results is given
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