3D double sided detector fabrication at IMB-CNM

Abstract

The Large Hadron Collider (LHC) recorded its first collisions during the last months of 2009. By 2020 a two-stage upgrade of the accelerator complex, the High Luminosity LHC (HL-LHC), will increase the instantaneous luminosities up to a factor of ten compared to the current design. The particle fluxes at ATLAS will increment substantially with special impact on the inner tracking detector which will be subjected to large occupancies and radiation damage. In order to cope with the higher instantaneous luminosities ATLAS will upgrade its current Inner Detector (ID) in two phases, first by introducing a new pixel layer (IBL) mounted directly on the beam pipe, and later by completely replacing the current ID with several layers of semiconductor detectors (pixels and strips). The upgrades to the ATLAS ID require the development of new silicon technologies, since the current planar pixel sensors are not suitable for the expected radiation doses at small radii. For these inner detector layers, the most promising technology is the so-called 3D sensor, while improved planar sensors are considered for the external layers. Silicon detectors with cylindrical electrodes offer advantages over standard planar sensors mainly because they are more radiation hard. 3D detectors with the double sided geometry have been fabricated at IMB-CNM clean room facilities. The layouts fits the new pixelated readout chip FE-I4 developed by the ATLAS collaboration.