Abstract
A short time reflow of 15s at 250°C, followed by a liquid nitrogen quench, of the Sn–3Ag–0.5Cu solder on a Cu substrate gave rise to a three-layer interfacial structure. In addition to the commonly known η-Cu6Sn5∕ε-Cu3Sn layers, an amorphous layer with a thickness of less than 50nm exists between the Cu substrate and the thin ε-Cu3Sn layer. Nanocrystalline ε-Cu3Sn cells, revealed by transmission electron microscopy (TEM), as fine as 10nm were detected within the amorphous region. The results of TEM analysis suggest that the nucleation of interfacial intermetallic compound ε-Cu3Sn occurs within the amorphous layer.
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