Abstract
The article presents the influence of lead-free solders on SnAg3.8Cu0.7 and SnCu0.7 tin matrices, as well as SnPb37 solder on the solubilization of copper under various conditions during dip soldering. The influence of lead-free solders, higher soldering temperatures and mobile soldering baths on the intensified effects of copper solubilization is demonstrated. Elements of soldering facilities coming into contact with SnCu3 solder-filled soldering bath are subject to solubilization and damage as a result. Protection of these elements and increase of their resistance by covering them with a ceramic layer based on Al2O3–TiO2 oxides was suggested.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
