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Abstract
The article presents the influence of lead-free solders on SnAg3.8Cu0.7 and SnCu0.7 tin matrices, as well as SnPb37 solder on the solubilization of copper under various conditions during dip soldering. The influence of lead-free solders, higher soldering temperatures and mobile soldering baths on the intensified effects of copper solubilization is demonstrated. Elements of soldering facilities coming into contact with SnCu3 solder-filled soldering bath are subject to solubilization and damage as a result. Protection of these elements and increase of their resistance by covering them with a ceramic layer based on Al2O3–TiO2 oxides was suggested.
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