Abstract

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

Highlights

  • For the High-Luminosity Upgrade of the Large Hadron Collider, the ATLAS [1] Inner Detector will be replaced with a new, all silicon Inner Tracker (ITk), composed of a pixel tracker [4] and a strip tracker [5].The main component of the ITk strip tracker is the module, comprising a silicon strip sensor, multiple custom readout chips mounted on a electronic circuit, called a hybrid, and a powerboard

  • Application Specific Integrated Circuits (ASICs) were first positioned in a dedicated chip tray with cutouts for each ABC130 ASIC, which aligned each ASIC with respect to locating holes matching those in hybrid panels

  • In order to investigate the radiation tolerance of the ABC130 barrel module, a mixed strip length module was irradiated with protons at the CERN PS to a fluence of 8 × 1014 neq/cm2, corresponding to the maximum NIEL fluence expected at the end of life-time in the short strip region of the ITk strip barrel

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Summary

Introduction

For the High-Luminosity Upgrade of the Large Hadron Collider, the ATLAS [1] Inner Detector will be replaced with a new, all silicon Inner Tracker (ITk), composed of a pixel tracker [4] and a strip tracker [5]. The main component of the ITk strip tracker is the module, comprising a silicon strip sensor, multiple custom readout chips mounted on a electronic circuit, called a hybrid, and a powerboard. In the central region of the ITk strip detector, the four barrel layers comprise 11,000 modules mounted on staves such that the sensors are arranged parallel to the beam axis (see figure 1a). Flexible circuit boards supporting ABC130 readout chips, called hybrids (section 2.3), were designed, with one hybrid required per two strip segments. Flex circuit boards called powerboards (section 2.4), which support a DCDC power converter, high voltage switch and a monitoring chip, match both LS and SS (a) ABC130 LS barrel module on an LS test frame: one X-type hybrid is mounted at the border between LS strip segments with the powerboard mounted on the same segment. Module layouts, thereby minimising the number of components to be designed, tested and qualified for production

Sensors
ABC130
HCC130
AMACv1a
Hybrids
High-voltage switching of up to -500 V to reverse bias the sensor
Hybrid assembly
Physical DAQ system
Firmware structure
Opcode sub-system
Software
Repeat from 2 until all parameter values scanned
Characterisation Tests
Hybrid tests
Powerboard assembly
Powerboard tests
Sensor tests
Module assembly
Sensor metrology after module assembly
Module tests
Dependence on number of strobed channels and triggers
Module noise and strip capacitance
Noise occupancy results
Comparison between Noise Occupancy and Three Point Gain
Sensor hysteresis
EMI pick up studies
Effect of powerboard on module noise
Irradiated modules
Electrical Shorts
Unbonded Classification and Bias Voltage
Findings
Conclusion and Outlook
Full Text
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