Test point insertion in hybrid test compression/LBIST architectures

Abstract

Logic built-in self-test (LBIST), originally introduced for board, system, and in-field tests, is now being increasingly used with on-chip test compression. This hybrid approach allows LBIST to become a complementary solution for in-system test, where high quality, low power, low silicon area, and most importantly short test application time are key factors affecting ICs that are targeted for safety-critical and automotive systems. Test points are common in BIST-ready designs where they play a key role in reducing both test application time given a test coverage goal and the overall silicon overhead so that one can get a desired coverage with the minimal number of patterns. Unfortunately, these test points are typically dysfunctional when enabled in an ATPG-based test compression mode. Similarly, test points used to reduce ATPG-based test pattern counts cannot guarantee desired random testability. Incompatibility of both types of test points has motivated research presented in this paper. We present a novel hybrid test point technology designed to both reduce deterministic pattern counts and improve fault detection likelihood by means of the same minimal set of test points. Experimental results obtained for large industrial designs illustrate feasibility of the proposed hybrid test points and are reported herein.