Abstract

Due to the difficulties associated with scaling of silicon transistors, various technologies beyond binary logic processing are actively being investigated. Ternary logic circuit implementation with carbon nanotube field effect transistors (CNTFETs) and resistive random access memory (RRAM) integration is considered as a possible technology option. CNTFETs are currently being preferred for implementing ternary circuits due to their desirable multiple threshold voltage and geometry-dependent properties, whereas the RRAM is used due to its multilevel cell capability which enables storage of multiple resistance states within a single cell. This article presents the 2-trit arithmetic logic unit (ALU) design using CNTFETs and RRAM as the design elements. The proposed ALU incorporates a transmission gate block, a function select block, and various ternary function processing modules. The ALU design optimization is achieved by introducing a controlled ternary adder–subtractor module instead of separate adder and subtractor circuits. The simulations are analyzed and validated using Synopsis HSPICE simulation software with standard 32 nm CNTFET technology under different operating conditions (supply voltages) to test the robustness of the designs. The simulation results indicate that the proposed CNTFET-RRAM integration enables the compact circuit realization with good robustness. Moreover, due to the addition of RRAM as circuit element, the proposed ALU has the advantage of non-volatility.

Highlights

  • Introduction published maps and institutional affilThe existing CMOS technology faces numerous critical issues in terms of high power dissipation, short channel effects, and reduced gate control when scaled to nanoscale dimensions

  • We present 2-bit ternary arithmetic logic unit (ALU) design utilizing carbon nanotube field effect transistors (CNTFETs) and Resistive random access memory (RRAM) device technologies

  • The model includes a full transcapacitance network for more accurate transient and dynamic performance simulations. This model accounts for the parasitic contact resistance by taking into account the tunneling through the Schottky barrier at the metal-to-Carbon Nanotubes (CNTs) interface

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Summary

Introduction

The existing CMOS technology faces numerous critical issues in terms of high power dissipation, short channel effects, and reduced gate control when scaled to nanoscale dimensions. These reliability issues have the tendency to significantly degrade the system performance in the near future. Semiconductor-based computation is the most used technology for such a task. This computation utilizes binary logic having two values (logic states) for its effective implementation. Several researchers over a period of time have pointed out various limitations of binary logic implementation, with the most significant one being that of the interconnection on chips as well as between the chips. The main source of power dissipation are interconnects, and they occupy about 70% of the active logic elements which are mostly caused by placements of the digital logic components, complex routing, and iations

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