Temperature-dependent dynamics of electrokinetic conservative and reactive transport in porous media: A model-based analysis

Abstract

Electrokinetic techniques employ direct current electric fields to enhance the transport of amendments in low permeability porous media and have been demonstrated effective for in situ remediation of both organic contaminants and heavy metals. The application of electric potential gradients give rise to coupled chemical, hydraulic and electric fluxes, which are at the basis of the main transport mechanisms: electromigration and electroosmosis. Previous research has highlighted the significant impacts of charge interactions and fluid composition, including temperature-dependent properties such as electrolyte conductivity and density, on these transport phenomena. However, current models of electrokinetic applications often assume isothermal conditions and overlook the production of heat resulting from Joule heating.This study provides a detailed model-based investigation, systematically exploring the effects of temperature on electrokinetic conservative and reactive transport in porous media. By incorporating temperature-dependent material properties and progressively investigating the impact of temperature on each transport mechanism, we analyze the effects of temperature variations in both 1D and 2D systems. The study reveals how temperature dynamically influences the physical, chemical and electrostatic processes controlling electrokinetic transport. A temperature increase results in a higher speed of amendments delivery by both electromigration and electroosmosis and increases the kinetics of degradation reactions. The simulations also reveal a feedback mechanism in which higher aqueous conductivity results in increased Joule heating, leading to a faster temperature rise and, subsequently, to higher electrolyte conductivity. Finally, we estimate the electric energy requirements of the system at varying temperatures and show how these changes impact the rate of contaminant removal.