Abstract
Soldering in a reflow oven is an important and efficient technical means to produce integrated circuit boards. The key to the quality of integrated circuit boards lies in the furnace temperature curve. In this paper, Newton’s law of cooling is used to establish the mechanism model of the temperature of each zone of the furnace and the curve of furnace temperature, which can reduce the number of experiments in actual production and obtain a better furnace temperature curve, thus improving production efficiency. Finally, several concrete examples are given to discuss and solve some common problems in the industry.
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