Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering

Abstract

In order to use mechanism model analysis instead of experimental test to control and adjust the temperature and oven temperature curve of each part of the integrated circuit board reflow oven to make it meet the process requirements, a fitting algorithm was used to establish a heat transfer model of the reflow soldering. The established reflow soldering heat transfer model was used to simulate and fit to obtain the integrated circuit board reflow soldering oven temperature curve, and compared it with the reflow soldering experiment curve to verify the reliability of the model’s simulation performance. The comparison results show that the reflow soldering oven temperature simulation curve is in good agreement with the experimental curve, and it can replace the experimental test to find the best. On this basis, the genetic algorithm was further used to optimize the temperature setting and oven temperature curve for integrated circuit boards. After optimization, the conveyor belt velocity of the integrated circuit board is preferably 1.4799cm/s, and the set temperature of temperature zones is 179 °C at small temperature zones 1~5, 185 °C at small temperature zone 6, 235 °C at small temperature zone 7, and 264 °C at small temperature zones 8~9; the area of the oven temperature curve that exceeds 217 °C decreases by $831.1611~^{\circ }\textrm {C}\cdot \text{s}$ , and its symmetry with respect to the peak is better, which is much closer to the ideal oven temperature curve. The research results provide a useful reference for the design of integrated circuit board reflow soldering process.