Abstract
Telecentric e-beam positioning systems are evaluated by computer simulation. Compared to post-lens double deflection and and deflection through the lens front focal point, the variable axis immersion lens (VAIL) concept is superior for applciation to lithography of pattern dimensions smaller than 0.5 um in fields larger than 4 mm. The simulations suggest that resolving power and telecentricity are conjugated in VAIL: Meeting the VAL condition is favorable for resolution, but not for perpendicular beam landing.
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