Abstract
This paper is a review that surveys work on the fabrication of miniature alkali vapor cells for miniature and chip-scale atomic clocks. Technology on microelectromechanical systems (MEMS) cells from the literature is described in detail. Special attention is paid to alkali atom introduction methods and sealing of the MEMS structure. Characteristics of each technology are collated and compared. The article’s rhetoric is guided by the proposed classification of MEMS cell fabrication methods and contains a historical outline of MEMS cell technology development.
Highlights
Atomic time and frequency standards based on the absorption of microwaves by Cs/Rb vapors were discovered in the 1950s [1,2]
Miniaturization of atomic clocks became a hot topic in the late 1990s after a series of publications showed technical and phenomenological fundamentals of fully optical coherent population trapping (CPT) atomic clocks [6,7,8]
The first technical realizations of microelectromechanical systems (MEMS) miniaturized Cs/Rb atomic clock were achieved by Kitching [9,10]
Summary
Atomic time and frequency standards based on the absorption of microwaves by Cs/Rb vapors were discovered in the 1950s [1,2]. The first technical realizations of microelectromechanical systems (MEMS) miniaturized Cs/Rb atomic clock were achieved by Kitching [9,10]. (1) fabrication of glass–silicon preform (deep reactive-ion etching, high-temperature anodic bonding),. (1) fabrication of glass–silicon preform (deep reactive-ion etching, high-temperature anodic (2) direct alkali metal introduction through pipetting, and bonding),. (2) direct alkali metal introduction through pipetting, and (3) final encapsulation low-temperature, long-lasting anodic. The cell consists of by deep reactive-ion (DRIE)-etched silicon bonding. The cell consists of deep reactive-ion (DRIE)-etched silicon body andconditions two glass
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