Abstract
One of the crucial factors for the thermo-mechanical reliability of electronic packages is warpage that occurs during the printed wiring board (PWB) fabrication, solder masking and solder reflow processes. As the quality and reliability requirements of electronic components (packages) become higher, warpage control becomes a more crucial process during the PWB fabrication (manufacturing) and package assembly processes. The warpage of PWBs, PWB assemblies and electronic packages are measured by various techniques. Each technique has both its advantages and disadvantages; therefore the choice of a particular technique depends on whether one wants to measure the warpage of a PWB, PWB assembly or chip package. This paper reviews the pros and cons, such as resolution, speed, costs, accuracy, in-line capability, flexibility, and robustness, of different techniques used for measuring the warpage of chip packages, PWBs and PWB assemblies.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Packaging and Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
