Abstract
Two main technical obstacles must be overcome to build a fruitful business in the nascent flexible microelectronics industry: the self-heating effect of thin film transistors (TFTs), and the thermal and mechanical durability of flexible devices. The self-heating effect is controlled through TFT shape, TFT electrical performance, dimensional reductions, and energy-efficient circuits. Plastic engineering is one of the keys to solving thermal and mechanical durability problems faced by flexible microelectronics devices. Once these obstacles are cleared, TFT circuits on plastic will spawn a new industry and markets for plastic large-scale integrations.
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