Abstract
Summary form only given. In this paper, we will trace the evolution of the microprocessor and its packaging technologies. It is seen that the packaging of these components have evolved from a passive mechanical enclosure to an active thermal/electrical management platform. Major advances in materials, design, modeling and integration were necessary to meet today's high-performance microprocessor packaging needs. Problems such as switching noise, EMI emission, power distribution and thermal management will become more aggravated. While multichip modules (MCM) have demonstrated excellent performance capabilities, their usage is hampered by poor economics and a lagging infrastructure.
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