Abstract
Pt-Ir silicide Schottky diodes were formed by e-beam evaporation of Pt and Ir onto p-Si(100) substrates in high vacuum with subsequent RTA-annealing at temperatures in the range of 300 to 500 °C. Rutherford Backscattering Spectrometry (RBS) and infrared photoresponse (PR) measurements were performed to determine the composition and the infrared electrooptical properties of the resulting films. Coevaporated Pt-Ir films are demixed during silicidation and form a PtSi layer at the interface to the silicon substrate. The Schottky barrier height is that of a pure PtSi film. Ir deposited prior to Pt exhibits Pt diffusion through the Ir layer. Only when the Ir film is reacted to IrSi by in situ annealing prior to Pt deposition, a mixed Ir-Pt silicide Schottky barrier is obtained. Infrared photoemission then yields intermediate Schottky barrier heights between those of PtSi and IrSi. From a detailed analysis of the photoemission characteristics, it is concluded that the intermediate barrier height is due to an area average of PtSi and IrSi grains which coexist at the Si interface.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
