Tailored Uniaxial Alignment of Nanowires Based on Off-Center Spin-Coating for Flexible and Transparent Field-Effect Transistors.

Abstract

The alignment of nanowires (NWs) has been actively pursued for the production of electrical devices with high-operating performances. Among the generally available alignment processes, spin-coating is the simplest and fastest method for uniformly patterning the NWs. During spinning, the morphology of the aligned NWs is sensitively influenced by the resultant external drag and inertial forces. Herein, the assembly of highly and uniaxially aligned silicon nanowires (Si NWs) is achieved by introducing an off-center spin-coating method in which the applied external forces are modulated by positioning the target substrate away from the center of rotation. In addition, various influencing factors, such as the type of solvent, the spin acceleration time, the distance between the substrate and the center of rotation, and the surface energy of the substrate, are adjusted in order to optimize the alignment of the NWs. Next, a field-effect transistor (FET) incorporating the highly aligned Si NWs exhibits a high effective mobility of up to 85.7 cm2 V−1 s−1, and an on-current of 0.58 µA. Finally, the single device is enlarged and developed in order to obtain an ultrathin and flexible Si NW FET array. The resulting device has the potential to be widely expanded into applications such as wearable electronics and robotic systems.