Abstract

We introduce the T2000 ISS final test (FT) solution using a chip probing (CP) light source for high-end image sensor package devices. The image sensor market is expanding day by day due in part to the influence of smartphones. Although charge-coupled devices (CCD) used to be the mainstream, CMOS Image Sensor (CIS) now account for the great majority of the market. While image sensor for smartphones now account for the great majority of shipments, demand for high-performance digital cameras such as single-lens reflex cameras is still alive and well, with higher image quality, faster data rates, and increased output pins. Progress has been made in developing technology that can capture the same or higher level of image quality as such images, and this technology has now matured. C-PHY 3.5Gsps simultaneous testing of up to 64 has been successfully measured in CP on an experimental trial. However, in the mass production of CIS, few tests are using a light source in FT. Or, even if a light source is used, most of the tests are done using a simple light source. In this paper, we introduce an automated test equipment (ATE) developed in cooperation with handler, socket, and light source vendors to meet the demand in the high-end digital camera market for the same level of testing in FT as CP. By using the same light source as that used in CP, there is no difference in performance. The light source is installed inside the test head, CIS need to orientation is the opposite of normal. In terms of temperature control, if the test items are the same as CP, it will take longer to device test and it will be difficult to keep the temperature constant in high temperature test. This solution solves these problems and achieves the same level of testing in FT as CP.

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