System-On-a-Package Technologies for Enabling Future Microsystems

Abstract

Future systems require the integration of mixed signal electronics consisting of RF, Analog, MEMS, opto-electronics and Digital blocks. One platform that enables such heterogeneous integration is the System On a Chip (SoC) approach that integrates functionality on Silicon. Lately, System On a Package (SoP) technologies that enable mixed signal integration have gained prominence. With the trend towards higher speeds, higher functionality, smaller size and lower cost, future micro-systems require the best of both SoC and SoP solutions for integration. However, this form of integration requires a careful understanding of the circuits to be placed in silicon or in the package and the interaction between the two. This presentation will discuss the role of SOC and SOP platforms for enabling future micro-systems. This presentation will also discuss the technologies required for SOP implementations and the research ongoing at Georgia Tech and around the world in this area.